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MLCC MLCL MLV Silver Carrier Plate / Array Thin Carrier Plate ATCP 1.3mm Chip Parts Precision Components
Thin Carrier Plate is Dipping Tool which can be used successfully to handle a veriety of Chip
componets such as MLCC ,MLCI,MLV Etc. they mainly used in the Dipping Machine and Yohotek Dipping Machine
Feature
1: Work temperature:130 or 160
2: Thickness:1.30mm(±0.02)
Advantages
Holding chip(Dipping chip)
High Load efficiency
Low distortion
Save time,Reduce labor and Tooling cost of Dipping
0603(0201) chip can be dipped Two side Easily
Defect-Free Dipping surface
Easy to Operate Automatically
Termination Bandwidth is easily controlled
MOQ:1000pcs
Customized design is available. OEM&ODM are welcome.
Specification
Item No : YTCP0402-020-13776-130
Hole Diameter(mil): 20.00
Hole Qty(mm) : 3776
Thickness(mm) : 130.00
| Item No | Hole Diameter(mil) | Hole Qty(mm) | Thickness(mm) |
| YTCP0402-020-13776-130 | 20.00 | 3776 | 1.30.00 |
Remark:
Customized design is available. OEM&ODM are welcome.
Applications:
1: For Holding chip(Dipping chip)
2: Auto-loading machine/Vibration machine, Air press,Dipping machine,oven,
Trade terms & conditions:
1. Payment term: 100% for sample; For bulk order: 30% deposit and 70% balance before shipment. 2. Payment way available: T/T, Paypal, Western Union. L/C
3. Lead time: 3-5 working days for samples, 10-15 working days for quantity order.
4. Shipping port: Shenzhen.
5. Delivery way: Via Sea, Air and Air express (DHL, FEDEX, EMS, UPS, TNT) or other ways.
6. MOQ: 5 piece.
7. Discounts:
MLCC MLCL MLV Silver Carrier Plate / Array Thin Carrier Plate ATCP 1.3mm Chip Parts Precision Compon
